COOLTHERM EP-6009

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

COOLTHERM EP-6009

Main features

  • 2,600 cP Mixed Viscosity
  • 0.7 W/(m K) Thermal Encapsulation
  • Electrically Insulating Encapsulation

Product Description

CoolTherm® EP-6009 Epoxy Encapsulant is a two-component epoxy system designed to provide thermal conductivity for potting applications requiring flame retardance. The black mixed material combines a typical viscosity of 2,600 cP at 25°C with a 60-minute working life, supporting application through handheld cartridges or automatic meter/mix/dispense equipment. After cure, the system provides typical thermal conductivity of 0.7 W/m·K together with electrical insulation and rigid mechanical properties.

Key features

  • Thermally conductive encapsulation: Provides a typical cured thermal conductivity of 0.7 W/m·K for potting applications requiring heat dissipation.
  • Low mixed viscosity: The mixed system has a typical viscosity of 2,600 cP at 25°C to support dispensing and flow during encapsulation.
  • Electrical insulation: Provides typical volume resistivity of 1.0 × 1015 ohm-cm at 25°C and dielectric strength of 500 V/mil after cure.

Applications / Suitable for

  • Thermally conductive potting applications requiring flame retardance
Product Family

COOLTHERM EP-6009

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance Appearance
Resin: Black Liquid | Hardener: Amber Liquid | Mixed: Black Liquid
Specific Gravity Specific Gravity
Resin: 1.65 | Hardener: 1.00 | Mixed: 1.52
Physical Properties
Viscosity (Part A) Viscosity (Part A)
(Resin) 17500 mPa.s
Viscosity (Part B) Viscosity (Part B)
(Hardener) 40 mPa.s
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
75 °C
Thermal Conductivity Thermal Conductivity
0.7 W/m.K
Electrical Properties
Dielectric Strength Dielectric Strength
0.5 kV/mm
Volume Resistivity Volume Resistivity
1.0 x 10^15 Ohms⋅cm
Mechanical Properties
Elongation Elongation
at break 1.9 %
Chemical Properties
Moisture absorption Moisture absorption
10 days @25°C 0.35 %

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties of the CoolTherm EP-6009 BLK resin, EP-6009 hardener, and mixed encapsulant before cure. Values are not intended for specification purposes.

Property Value Unit Method / condition
Appearance Black liquid / Amber liquid / Black liquid — EP-6009 BLK resin / EP-6009 hardener / mixed system
Viscosity 17,500 / 40 / 2,600 cP EP-6009 BLK resin / EP-6009 hardener / mixed system at 25°C; test method not stated
Specific gravity 1.65 / 1.00 / 1.52 — EP-6009 BLK resin / EP-6009 hardener / mixed system; test conditions not stated
Mix ratio by weight 10:1 Resin:hardener CoolTherm EP-6009 BLK resin : CoolTherm EP-6009 hardener
Gel time 28 minutes Mixed system at 65°C; test method not stated
Working life 60 minutes Mixed system at 25°C; test method not stated
Cure time 2–4 hours At 65°C after the material reaches the target temperature
Shelf life 1 year Each component from date of manufacture when stored at 25°C in the original, unopened container
Technical properties

After-processing / final-state properties

Typical cured properties of the CoolTherm EP-6009 BLK resin and EP-6009 hardener system. The documented cure schedule is 2–4 hours at 65°C after the material reaches the target temperature. Values are not intended for specification purposes.

Property Value Unit Method / condition
Thermal conductivity 0.7 W/m·K Test method not stated
Coefficient of linear thermal expansion 47 ppm/°C Test method and temperature region not stated
Glass transition temperature 75 °C TMA
Hardness 90 Shore D Test method not stated
Tensile strength 48.3 (7,000) MPa (psi) ASTM D638
Elongation at break 1.9 % ASTM D638
Moisture absorption 0.35 % 10 days at 25°C; exposure medium and test method not stated
Volume resistivity 1.0 × 1015 ohm-cm ASTM D257 at 25°C
Dielectric strength 500 V/mil Test method and specimen thickness not stated

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