LOCTITE ECCOBOND FP4502
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- One component
- Low CTE
- No-clean flux compatible
Product Description
LOCTITE® ECCOBOND FP4502 is a high purity, liquid epoxy designed as an underfill for flip chip devices. It is a single component epoxy with low CTE that has an improved toughness and forms a rigid, low stress seal.
LOCTITE® ECCOBOND FP4502 is used to dissipate stress on solder joints, extends thermal cycling performance, is compatible with no clean flux and has improved crack and fracture resistance.
Cure Schedule
- 30 minutes @ 165°C
- 2 minutes, hours @ 150°C
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Pot Life
Pot Life
24 hours
Specific Gravity
Specific Gravity
1.68
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
115 °C
Physical Properties
Viscosity
Viscosity
35,000 mPa.s
