LOCTITE ECCOBOND FP4527
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Low viscosity
- High flow
- Excellent wettability
Product Description
LOCTITE® ECCOBOND FP4527 epoxy underfill has excellent wettability and is typically used on a semiconductor level as a capillary underfill.
LOCTITE® ECCOBOND FP4527 is a low viscosity, high flow, epoxy based material designed for capillary underfill on flip chip applications.
Cure Schedule
- 15 minutes @ 165°C (hot plate)
- 30 minutes @ 165°C (convection)
- 1hour @110°C + 30 minutes @150°C (convection)
ECCOBOND FP4527
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TDS, SDS & Technical Documents
Technical Specifications
General Properties
Filler Content
Filler Content
68 %
Pot Life
Pot Life
48 hours
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
158 °C
Chemical Properties
Moisture absorption
Moisture absorption
1.5 %
Physical Properties
Viscosity
Viscosity
12,000 mPa.s
