KESTER 2166-BN Soldering Flux

Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)

KESTER 2166-BN Soldering Flux

Main features

  • Halide-free formulation
  • Superior surface insulation resistance
  • Easy residue removal

Product Description

Kester 2166-BN is a halide-free, organic flux designed for automated soldering of circuit board assemblies. It provides excellent activity on bare copper and solder-coated boards while ensuring easy residue removal and superior compatibility with solder resists.

Product Key Features

  • Contains no chlorides, bromides, phosphates, or highly corrosive materials
  • Effective on both bare copper and solder-coated boards
  • Outperforms typical water-soluble fluxes, ideal for SMT assemblies
  • Works well with solder resists compared to other water-soluble fluxes.

Applications

  • for high-speed, automated assembly lines.
  • Provides reliable soldering for advanced surface mount (SMT) electronic assemblies.
  • also ideal for bare copper & solder-coated boards
Product Family

KESTER 2166-BN

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Technical Specifications

General Properties
Solids Solids
31 %
Specific Gravity Specific Gravity
1.144

Additional Information

Flux Application

2166-BN can be applied to circuit boards by a spray, dip, or wave process. An air knife after the flux tank is recommended to remove excess flux if used in a dip or wave application to remove any excess flux to prevent dripping on the preheater surface.

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