LOCTITE STYCAST E2517
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Low CTE
- Low Viscosity
- High temperature resistance
Product Description
LOCTITE® STYCAST E 2517 epoxy encapsulant is formulated for use on bare chip protection in a variety of advanced packages where ease of flow and high thermal stability are required.
Recommended Cure Schedule
- Precure 1 hour @ 120°C
- Full cure 1 hour @ 150°C
- Post cure 2 hours @ 200°C
STYCAST E2517
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TDS, SDS & Technical Documents
Technical Specifications
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
220 °C
Thermal Conductivity
Thermal Conductivity
0.5 W/m.K
Chemical Properties
Water Absorption
Water Absorption
0.08 %
Physical Properties
Viscosity
Viscosity
22,500 mPa.s
