Hysol GR600 SL2| Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- High reliability
- High power applications
- Good electrical performance
Product Description
Hysol GR600 SL2 is a halogen free, black, silica filled (87% filler weight) semiconductor grade epoxy molding compound designed for TO packages. This low stress, low moisture absorption product is a commercial success with many uses on TO applications.
Hysol GR600 SL2 is a green, heat curable epoxy molding compound that can be used in semiconductor packages such as TO252. Furthermore, it meets UL 94 V-0 flammability at 1/8 inch thickness.
HYSOL GR600
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TDS, SDS & Technical Documents
Technical Specifications
General Properties
Color
Color
Black
Filler Content
Filler Content
87 %
Specific Gravity
Specific Gravity
2.03
Electrical Properties
Volume Resistivity
Volume Resistivity
14400000000000000 Ohms⋅cm
Chemical Properties
Moisture absorption
Moisture absorption
0.30 %
Physical Properties
Spiral Flow @ 175°C
Spiral Flow @ 175°C
83 cm
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
165 °C
Curing Conditions
Transfer Pressure
Transfer Pressure
40 - 85 kg/cm2
Transfer Time
Transfer Time
5 - 15 s
