Hysol GR910-C | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Halogen free
- High fluidity
- Designed for BGA/LGA
Product Description
Hysol GR910 C is a black, epoxy, semiconductor grade molding compound designed for Memory ball grid arrays (BGA) and land grid arrays (LGA). This spherical silica filled product (cut size of 75um), offers high fluidity and low shrinkage that aids a very advanced warpage control.
Hysol GR910 C is a halogen free, environmentally friendly compound with good electrical performance that meets UL 94 V-0 Flammability at 1/8 inch thickness. You might also be interested in GR910-C4 an identical product with even lower smile shrinkage.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Color
Color
Black
Filler Content
Filler Content
88 %
Specific Gravity
Specific Gravity
2.01
Chemical Properties
Moisture absorption
Moisture absorption
0.3 %
Physical Properties
Spiral Flow @ 175°C
Spiral Flow @ 175°C
203 cm
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
130 °C
Thermal Conductivity
Thermal Conductivity
0.9 W/m.K
Curing Conditions
Transfer Pressure
Transfer Pressure
40 - 85 kg/cm2
Transfer Time
Transfer Time
7 - 15 s
