Hysol KL-3000FF | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Hysol KL-3000FF | Black Epoxy Mold Compound

Main features

  • Low CTE (18 ppm/°C)
  • Low stress
  • For GBU, KBU, SOP packages

Product Description

Hysol KL-3000FF is a black, semiconductor grade, high productivity molding compound, providing low stress and high reliability. It is 74% filled and achieves a flammability rating of V0 at UL94 testing conditions.

Hysol KL-3000FF is an environmentally friendly molding compound with high moldability that has a low coefficient of thermal expansion (18ppm/°C). It is typically used for SOD, KBU,GBU and DIP semiconductor packages.

Product Family

HYSOL KL-3000FF

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color Color
Black
Filler Content Filler Content
74 %
Specific Gravity Specific Gravity
1.86
Chemical Properties
Moisture absorption Moisture absorption
0.40 %
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
165 °C
Thermal Conductivity Thermal Conductivity
0.7 W/m.K
UL 94 Rating UL 94 Rating
V0
Electrical Properties
Volume Resistivity Volume Resistivity
15000000000000000 Ohms⋅cm
Mechanical Properties
Molded Shrinkage Molded Shrinkage
0.30 %
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
71 cm
Curing Conditions
Transfer Time Transfer Time
10-25 s

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